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扩散炉
Diffusion Furnaces
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应用领域:
IC
fab, pilot line, MEMS, photonics, display.
设备特性:
ProTemp Products 生产各种型号的diffusion furnaces.
·提供各种扩散炉: Atmospheric, LPCVD, PECVD.
·可容纳4" to 12" wafer sizes.
·可配置多达4层炉管. 每层独立控制. 整机结构紧奏.
·自动控制, 自动工艺, auto loaders at each tube
level.
·具有多种功能选择, 包括 HiTemp 1400C, internal
or external torch, multiple FMC-controlled
gas lines, and
many more.
·优秀的性价比, excellent cost of ownership.
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太阳能电池专用扩散炉
Diffusion Furnaces
for Solar Cell
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应用领域:
Solar
cell manufacturing and pilot lines.
设备特性:
ProTemp 生产 POCl3 diffusion furnaces
and PECVD ARC furnaces, 用于PV电池生产和研发.
·可容纳 up to 156mm x 156mm solar substrates.
·Over 40" flat zone for volume
production.
·可配置多达4层炉管. 每层独立控制. 整机结构紧奏.
·Automatic cantilever substrate loading.
·POCl3 tubes and PECVD ARC tubes can
be built on the same furnace.
·POCl3 and ARC processes are provided.
·Processes for advanced dual-layer Anti-Reflective
Films are available.
·优秀的性价比, excellent cost of ownership.
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替换炉体
Furnaces Heating
Element |
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应用领域:
直接替换炉体.
设备特性:
ProTemp Products 生产各种型号的 furnace heating
elements, 包括以下各种 OEM furnaces:
·适用于各种 OEM furnaces, 包括 ProTemp Sirius,
Tempress, Kokusai, TEL, ASM, Thermco,
等.
·Three series of elements are available:
·Standard elements
for direct replacement of OEM elements.
·HiTemp™ high
temperature elements for operating temperatures
to 1350℃.
·FasTemp™ elements
employ light gauge heating wire to substantially
reduce times to reach operating temperature
and return to ambient. |
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生产型离子刻蚀
Plasma Etching Systems |
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应用领域:
IC fab.
设备特性:
APTC 的离子刻蚀系统用于大中型 IC Fab.
·APTC 专利的Adaptive Plasma Etch 全自动生产型离子刻蚀系统.
·用于8" 和12" 生产线, SiO2, Si3N4,
polysilicon, and metal etch.
·Excellent performances in etch uniformity,
repeatability, selectivity, COO. |
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反应离子刻蚀,
去胶
ICP, RIE, and Ashing
Systems |
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应用领域:
IC pilot line, R&D lab, LED, MEMS, solar
cell, photonics, display.
设备特性:
AXIC 生产 ICP, RIE, 以及 Plasma ashing 离子刻蚀,
去胶, 表面清洗等工艺设备.
· 科研及小量生产型, Manual wafer loading.
· 提供多种选择,包括 loadlock, 多路气体, 高频, 低频或双频
rf 电源.
· 可刻蚀SiO2, Si3N4, BPSG, poly-Si, metal.
· Si, GaAs, SiC 等材料.
· 容纳小片样品到12” 以内各种晶片. |
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等离子淀积
PECVD Systems
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应用领域:
IC pilot line, R&D
lab, LED, MEMS, solar cell, photonics,
display.
设备特性:
AXIC生产平行电极 (parallel
plate) PECVD 和 ICP PECVD 工艺设备.
·科研及小量生产型, Manual wafer loading.
·提供多种选择,包括 loadlock, 多路气体, 高频, 低频或双频
rf 电源.
·SiO2, Si3N4, PSG, BPSG 等薄膜.
·Si, GaAs, SiC 等材料.
·容纳小片样品到12" 以内各种晶片. |
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快速退火设备
Rapid Thermal
Process (RTP) Systems |
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应用领域:
IC fab, wafer manufacturing, LED, MEMS,
solar cell, photonics, display.
设备特性:
MPT 提供先进的快速退火工艺解决方案，具有手动到全自动的系列生品设备.
·RTP-600S是桌面型系统国际领先产品，广泛应用于 LED, GaAs,
InP, SiGe, 等工艺。全球范围
内，在科研领域以及LED生产企业的市场占有率超过50％。
·RTP-3000是全自动生产设备, 用于4"-12"生产线,
best COO.
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激光划片
Laser Dicing |
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应用领域:
LED,
MEMS,和化合物半导体(GaAs, GaN)等生产.
设备特性:
JPSA 激光划片系列产品,高精度、超窄切痕可大大提高晶片的器件利用率.
·先进的266nm 或 355nm DPSS 激光工艺，器件优质率超过99％.
·JPSA专利的正面或反面高精度切割,切痕2.5μm.
·优质高产，每小时可超过10片（典型2"蓝光LED). |
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LED激光剥离
LED Laser
Liftoff |
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应用领域:
LED.
设备特性:
LED liftoff with Excimer laser.
·JPSA patent pending technology.
·Uses 266nm UV excimer laser, advantageous
over 355nm DPSS rastering technique.
·Single shot with large fiend of view
(LFOV).
·Works in conjunction with JPSA laser
dicing system. |
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化学机械抛光设备
CMP Systems
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应用领域:
LED.
设备特性:
G&P Technology
的化学机械抛光设备是专为小批量生产和研发提供的产品。具有结构紧凑，使用方便，高精度，高重复性，低使用成本等特点。产品并可按用户要求定制。
G&P 的CMP设备已被包括Berkley大学在内的多家MEMS研究机构使用。
·Advanced CMP technology.
·Manual loading, auto sequence, dry-in,
wet-out. Sample size: coupon to 12".
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晶片清洗设备
Wafer Cleaning
Systems |
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应用领域:
Post-CMP
cleaning for R&D and pilot IC fab,
MEMS, LED.
设备特性:
P&G Technology
提供CMP工序之后的晶片清洗设备, Scrub Cleaning Systems
and Mega-sonic Cleaning Systems. 设备配置可按用户需求提供.
·Scrub Cleaner. 具有PVA软刷和无接触清洗等先进技术.
清洗效率高,
无晶面磨损.
·Manual loading, auto sequence, wet-in,
dry out.
·用于4"– 8"wafers. |
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倒片机
Wafer Transfer
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应用领域:
IC fab, wafer manufacturing,
solar cell, high volume MEMS.
设备特性:
Mactronix 生产全系列倒片设备,市场占有率居全球之首.
·提供多种选择型号, 1, 2 or 3 stations, 25 or
50 wafers, 可有高温操作
功能.
·可用各种cassette和用户特定的quartz boat. 可用于4"-12"生产线.
·Mactronix 还提供 reticle loader, wafer
pack/unpack system. |
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分片机
Sorter and Loader |
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IC
fab, wafer manufacturing, solar cell,
high volume MEMS.
设备特性:
Mactronix 生产全系列分片设备(sorter),
市场占有率也居全球之首.
·提供多种选择型号, 2 cassette and 4 cassette
sorters, integrated microscope,OCR.
Work with
FOUP or POD for 300mm.
·Mactronix还提供, wafer ID reader and
wafer selector systems. |
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晶片表面检测台
Wafer Inspection
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应用领域:
IC fab, wafer manufacturing,
solar cell, high volume MEMS.
设备特性:
Mactronix 生产多种型号的晶片表面检测台以及microscope
loaders.
·提供多种选择型号, cassette loading, automatic
wafer
handling, visual
inspection, and microscope inspection.
·还提供 microscope loaders. |
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晶片转换工具
Wafer Handling Tools |
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应用领域:
IC fab, wafer manufacturing, solar cell,
MEMS.
设备特性:
Mactronix. 生产各种wafer handling 工具.
· 各种手动和自动
flat/notch finders.
· 手动
casstte-to-cassette wafer transfers.
有SED safe option.
· 各种手动和自动
wafer selectors for inspection and selection.
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