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立式扩散炉
Vertical Furnaces |
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应用领域:
IC fab.
设备特性: SVG 立式扩散炉. 全球IC业界广泛应用.
·APCVD, LPCVD, 6”, 8” wafers.
·Automatic cassette to cassette processing.
·Significantly reduce contamination and particles.
·Excellent quality and reliability. |
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横式扩散炉
Horizontal
Furnaces
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应用领域:
IC fab, Solar
Cell, MEMS, photonics, display.
设备特性:
Horizontal diffusion furnaces, excellent CoO.
·提供各种扩散炉: Atmospheric, LPCVD, PECVD, 4” to 12” wafers.
·可配置多达4层炉管. 每层独立控制. 整机结构紧奏.
·自动控制, 自动工艺, 多种功能选择
·优秀的性价比, excellent cost of ownership. |
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小型扩散炉
Compact
Furnacess
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应用领域:
IC, Solar,
MEMS, LED
设备特性:
小型, 灵活, 经济, 功能齐全. 适合R&D和小型量生产.
·有台面型和落地型. Annealing, Diffusion, LPCVD.
·4” 到 12”. 炉体长度有多种选择.
·多路气体, MFC 控制.
·最佳性价比.
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翻新扩散炉
替换炉体
Refurbished
Furnaces Heating Elements
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应用领域:
IC fab,
pilot line, MEMS, solar cell.
设备特性:
提供各种型号的翻新 furnaces and heating elements.
·各种炉型: Vertical, Horizontal, Diffusion, LPCVD.
·各种 OEM furnaces, 包括Tempress, Kokusai, TEL,
ASM, Thermco 等.
·控制软件升级. 炉管升级.
·OEM direct replacement heating elements.
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| 二极管刻蚀制膜
Microwave Diode Etching and
Passivation |
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应用领域:
Diode production,
MEMS.
设备特性:
二极管生产, moat etch, junction damage removal, passivation.
·Microwave plasma processes.
·High efficiency moat etch.
·P-n junction damage removal and pacivation.
·Reduce p-n junction leakage. Improve device reliability
and repeatability. |
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| 太阳能电池干法制绒
Solar Cell Dry Texuring |
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应用领域:
Solar cell.
设备特性: Microwave plasma texturing
of solar cell surfaces.
·High efficiency microwave plasma processes.
·Improve cell efficiency.
·Reduce wafer breakage. Improve process reliability.
·Pilot or High volume production, up to 3,000
WPH. |
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| 等离子刻蚀,
去胶 ICP,
RIE, and Ashing Systems |
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应用领域:
IC pilot line, R&D lab, LED, MEMS, solar cell,
photonics, display.
设备特性: ICP, RIE, 以及 Plasma ashing
离子刻蚀, 去胶, 表面清洗等工艺设备.
·科研及小量生产型, Manual wafer loading.
·提供多种选择,包括 loadlock, 多路气体, 高频, 低频或双频 rf 电源.
·可刻蚀SiO2, Si3N4, BPSG, poly-Si, metal, Si, GaAs,
SiC 等材料.
·有落地式和台式. |
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等离子淀积
PECVD
Systems |
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应用领域:
IC pilot line, R&D lab, LED, MEMS, solar cell, photonics,
display.
设备特性: AXIC生产平行电极 (parallel plate)
PECVD 和 ICP PECVD 工艺设备.
·科研及小量生产型, Manual wafer loading.
·提供多种选择,包括 loadlock, 多路气体, 高频, 低频或双频 rf 电源.
·SiO2, Si3N4, PSG, BPSG 等薄膜.
·Si, GaAs, SiC 等材料.
·容纳小片样品到12" 以内各种晶片. |
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| 溅射淀积
Magnetron Sputtering Systems |
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应用领域:
IC pilot line, R&D lab, LED, MEMS, photonics,
display.
设备特性: 按应用所需提供多种选项. 性价高.
·科研及小量生产型, Manual wafer loading.
·提供多种选择,包括 loadlock, 多路气体,Combinatorial.
·有落地式和台式. 样品温度控制, 可达700C. RF or DC sputtering.
·Up to 3 off-axis magnetrons.
·Designed for flexibility to meet various
application requirements. |
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| 蒸发淀积
Thermal Evaporators |
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应用领域:
IC pilot line, R&D lab, LED, MEMS, photonics,
display.
设备特性: 按应用所需提供多种选项. 性价高.
·科研及小量生产型, Manual wafer loading.
·Dual crucible source with rotating platen.
·提供多种选择,bell-jar 或 金属铝腔体;
·turbo pump 或 dry pump. 真空可达10-6 torr.
·可选有 crystal thickness monitor. |
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| 快速退火设备
Rapid
Thermal Process (RTP) Systems |
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应用领域:
IC fab, wafer manufacturing, LED, MEMS, solar cell,
photonics, display.
设备特性: MPT 提供先进的快速退火工艺解决方案，具有手动到全自动的系列生品设备.
·RTP-600S是桌面型系统国际领先产品，广泛应用于 LED, GaAs, InP, SiGe,
等工艺。全球范围
内，在科研领域以及LED生产企业的市场占有率超过50％。
·RTP-3000是全自动生产设备, 用于4"-12"生产线, best COO.
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| 晶片清洗设备
Wafer
Cleaning Systems |
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应用领域:
IC pilot line, R&D lab, LED, MEMS, photonics,
display.
设备特性: 用途广,落地式,台式, Magsonic
or Chemical
·Patterned or Un-patterned Wafer Cleaning
for Si, Ge, GaAs, InP 等.
·Post CMP, Etch, PR Stripping Wafer Cleaning
·Cleaning of Mask Blanks, Contact Masks, Pelliclized
Reticle.
·Cleaning of the ITO coated Display Panels.
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| 倒片机
Wafer
Transfer Systems |
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应用领域:
IC fab, wafer manufacturing, solar cell, high
volume MEMS.
设备特性: Mactronix 生产全系列倒片设备,市场占有率居全球之首.
·提供多种选择型号, 1, 2 or 3 stations, 25 or 50 wafers,
可有高温操作功能.
·可用各种cassette和用户特定的quartz boat. 可用于4"-12"生产线.
·Mactronix 还提供 reticle loader, wafer pack/unpack
system. |
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| 分片机
Sorter
and Loader |
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应用领域:
IC fab, wafer manufacturing, solar
cell, high volume MEMS.
设备特性: Mactronix 生产全系列分片设备(sorter),
市场占有率也居全球之首.
·提供多种选择型号, 2 cassette and 4 cassette sorters,
integrated microscope, OCR.
·Work with FOUP or POD for 300mm. |
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晶片表面检测台
Wafer
Inspection Station |
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应用领域:
IC fab, wafer manufacturing, solar cell, high
volume MEMS.
设备特性: Mactronix 生产多种型号的晶片表面检测台以及microscope
loaders.
·提供多种选择型号, cassette loading, automatic wafer
handling, visual inspection, and microscope
inspection.
·还提供 microscope loaders. |
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晶片包装机
Wafer Packing Unpacking
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应用领域:
IC fab, wafer manufacturing, high volume MEMS.
设备特性: 将晶片从cassette自动放入shipping
container, 以便捆包, 装运.
·将25片晶片放入container, 片间放入separator.
·可选packing 或 unpacking.
·台面式, 占面积少, 操作方便.
·每小时可做250片. 高效可靠.
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扩散炉自动装舟机
Horizontal
Furnace Loader |
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应用领域:
IC fab, wafer manufacturing, solar cell, high
volume MEMS.
设备特性: 用于横式扩散炉晶片舟的自动装卸.
·适用于各种型号的横式扩散炉.
·石英舟, SiC舟等都适用.
·可用于多达4层炉管.
·占地面积少, 操作方便, 效率高. |
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| 晶片转换工具
Wafer
Handling Tools |
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应用领域:
IC fab, wafer manufacturing, solar cell, MEMS.
设备特性:
Mactronix. 生产各种wafer handling 工具.
· 各种手动和自动
flat/notch finders,4”–12”wafers.
· 手动台面倒片器
casstte-to-cassette slide wafer transfers.有SED
safe option.4”–12”wafers.
· 各种手动和自动选片器
wafer selectors for inspection and selection.
· Wafer
ID reader. Vision enhancer. |
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| 激光划片
Laser
Dicing |
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应用领域:
LED, MEMS,和化合物半导体(GaAs,
GaN)等生产.
设备特性:
JPSA 激光划片系列产品,高精度、超窄切痕可大大提高晶片的器件利用率.
·先进的266nm 或 355nm DPSS 激光工艺，器件优质率超过99％.
·JPSA专利的正面或反面高精度切割,切痕2.5μm.
·优质高产，每小时可超过10片（典型2"蓝光LED). |
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| LED激光剥离
LED
Laser Liftoff |
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应用领域:
LED.
设备特性:
LED liftoff with Excimer laser.
·JPSA patent pending technology.
·Uses 266nm UV excimer laser, advantageous over
355nm DPSS rastering technique.
·Single shot with large fiend of view (LFOV).
·Works in conjunction with JPSA laser dicing system.
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