应用领域:
MEMS, photonics, nano technologies. 电子器件,医疗器件,航空航天.
设备特性:
UV laser and CO2 laser micro machining.
· Uses excimer laser or DPSS laser with wavelengths ranging from 157nm to 355nm for various materials and geometric features.
· Large fiend of view (LFOV).
· Granite optical base, air bearing work stage.
