应用领域: IC fab, wafer manufacturing, LED, MEMS, photonics.
设备特性:Laser scanning technique, fast, accurate, non-invasive.
·Advanced stress measurement system using optilever laser scanning.
·Mapping whole wafer, 3D and 2D display.
·Measures film stress and wafer bow.
·Over 400 systems installed in IC fabs and R&D labs worldwide.
