Ellipsometry is a technique utilizing polarization state changes after light beam reacts with probing samples. Not like reflectometer, spectroscopic ellipsometer parameters (Psi and Del) are always obtained at non normal incident angles. By varying incident angle. many more data sets can be obtained which wiil be helpful in refining model, reducing uncertainty and improving user's confidence on model's output. Therefore, variable angle ellipsometer is far more powerful than fixed angle ellipsometer systems. There are two ways to change incident angles, manually or automatically. Ansgtrom Sun technologies Inc designed both angle adjustment models, manually adjusting agnle by moving arms at 5 degree interval following precisely preset slots(manual goniometer, SExxxBM, low cost version), and motorized precision goniometer with 0.01 degree resolution(SExxxBA). In addition, goniometers are engineeringed at vertical layout so samples could be placed horizontally, which is safer when handling samples. With reliable and enough raw data sets, many film properties, like film thickness, its optical constants, interface, porosity and even composition can be obtained through modeling. In this sense, advanced software is a must for high performance spectroscopic ellipsometer (SE) tools. We developed TFProbe 3.X version software for system setup. simulation, measurement, analysis, data management and 2D/3D graphics presentation. It is all-in-one.
When a very small probing spot is desired for some applications, like features on MEMS or semiconductor product wafers, microspectrophotometer is prefered to use. It can be integrated with spectroscopic ellipsometer to provide the needs for small measurement area capability. Model SExxxBA-MSP or Model SExxxBM-MSP is designed for such purpose. MSP works under reflectometry mode and run measuremment at normal incident angle which is complimentary to non-normal incident angle SE setup
FEATURES:
● Easy to operate with Window based software
● Advanced optics design for best system performance
● Automatically change incident angles at 0.01 degree resolution
● High Power DUV-VIS light source for broad band applications
● Array based detector system to ensure fast measurement
● Measure film thickness and Refractive Index up to 12 layers
● Capable to be used for real time or in-line thickness, refractive index monitoring
● System comes with comprehensive optical constants database and library
● Advanced TFProbe 3.3.X Software allows user to use either NK table, dispersion or effective media approximation (EMA) for each individual film.
● Three different user level control: Engineer mode, system service mode and easy user mode
● Flexible engineer mode for various recipe setup and optical model testing
● Robust one click button (Turn-key) solution for quick and routine measurement
● Configurable measurement parameters, user preference and easiness of operation
● Fully automatic calibration and initialization for system
● Precise sample alignment interface from sample signal directly, no external optics needed
● Precise height and tilting adjustment
● Apply to many different type of substrates with different thickness
● Various options, accessories available for special configurations such as mapping stage, wavelength extension, focus spot etc.
● 2D and 3D output graphics and user friendly data management interface
● Digital Imaging Tool for Micron region selection
● Integrated Reflectometer for Reflection measurement over small region
SYSTEM CONFIGURATION:
● Model: SE200BA-MSP300
● Detector: Detector Array
● Light Source: High Power DUV-Vis-NIR Combined Light Source for SE and High Power Visible Light Source for MSP
● Incident Angle Change: Automatic with Program setting
● Stage: Automatic Mapping with Rho-Theta configuration
● Software: TFProbe 3.3.X
● Combined SE and MSP
● Computer: Intel Duo Core Processor
● Monitor 19" Wide Screen LCD
● Power: 110– 240 VAC /50-60Hz, 6 A
● Warranty: One year labor and parts
SPECIFICATIONS:
● Wavelength range: 250 to 1000 nm for SE and 400 to 850nm for MSP
● Wavelength resolution: ~1 nm
● Spot Size: 1 to 5 mm variable for SE
● Incident Angle Range: 10 to 90 degree
● Incident Angle Change Resolution: 0.01 degree
● Digital Imaging: 1.3 MegPixels
● Effective Magnification: 1200x
● Long Work distance objective (12mm)
● MSP Beam Size: adjustable 10 - 500 um
● Sample Size: up to 300 mm in diameter
● Substrate Size: up to 20mm thick
● Measurable thickness range*: 0 nm to 10 µm
● Measurement Time: ~ 1s/Site
● Accuracy*: better than 0.25%
● Repeatability*: < 1 Å (1 sigma from 50 thickness readings for 1500 Å Thermal SiO2 on Si Wafer)
OPTIONS:
● Photometry measurement for Reflection at Non normal incident angle
● Transmission Measurement Module
● High resolution digital camera
● Ultra Long work distance objective for MSP
● Mapping X-Y Stage (X-Y mode, instead of Rho-Theta mode)
● Heating /Cooling Stage
● Vertical Sample Mounting Goniometer
● Wavelength extension to further DUV or IR range
● Scanning Monochromator Setup
APPLICATIONS:
● Semiconductor fabrication (PR, Oxide, Nitride..)
● Liquid crystal display (ITO, PR, Cell gap…..)
● Forensics, Biological films and materials
● Inks, Mineralogy, Pigments, Toners
● Pharmaceuticals, Medial Devices
● Optical coatings, TiO2, SiO2, Ta2O5…..
● Semiconductor compounds
● Functional films in MEMS/MOEMS
● Amorphous, nano and crystalline Si
NOTE:
● System configuration and Specifications subject to change without notice
● * Film property, surface quality and layer stack dependent
● Customized system available for special applications
● TFProbe is registered trademark of Angstrom Sun Technologies Inc.
