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| 四探针测试仪
Four
Point Probes |
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应用领域:
IC fab, wafer manufacturing, solar
cell, LED, MEMS, FPD, photonics.
设备特性:
Four
Dimensions 提供从手动到全自动的系列四探针测试仪。
·产品质量高, 应用广, 在全球市场享有很高声誉和市场占有率。
·可测量离子注入层、外延层及各种薄膜的方块电阻，并由此导出电阻系数、薄膜厚度、离子注入剂量。可具有高达12”直径自动
mapping 功能。
·精度高, 测量范围极广. Sheet resistance 可达 1E-3
to 8E+11 ohm/sq.
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| 汞探针测试仪
C-V Probes |
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应用领域:
IC fab,
wafer manufacturing, solar cell, LED, MEMS, FPD,
photonics.
设备特性:
Four Dimensions 提供从手动到全自动的系列汞探针C-V/I-V 测试仪。
·应用广泛: 介质薄膜品质, 外延层、离子注入层, 载流子浓度分布, 界面缺陷, SOI晶片特性,
铁电体材料特性等等。
·具有不同面积汞接触, 点-环接触等功能,针对厚膜、极薄膜及SOI等各类应用.
·积4D 三十年经验, 产品质量高, 性价好. |
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ECV 掺杂浓度检测
ECV Dopant Profiling |
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应用领域:
Solar
cell, IC, wafer manufacturing, MEMS, LED.
设备特性:
WEP is a world leader in ECV dopant profiling.
·Electrochemical CV profiling - 电解液CV (ECV)法检测掺杂-深度曲线.
·ECV 测量活性杂质, 直观简易, 优于 SIMS and SRP.
·ECV 广泛用于各种半导体工艺, Group IV (Si, Ge, SiC), Group
II/VI (GaAs, InP …), Group II/VII (CdTe, HgCdTe,
ZnO …), Nitrides (GaN, AlGaN …), 及其它化合物半导体 (AlGaAs,
GaInP, AlGaInP …) |
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金属膜厚检测
成份分析
XRF Metal Film Thickness and Composition |
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应用领域:
IC fab,
Solar Cell, MEMS, photonics, nano technologies.
设备特性:
XRF 检测金属膜厚及成份分析.
·IC process, B, P doping level, metal film thickness
and composition.
·Thin file solar cell, CIGS, CdTe, and more.
·Wafer size, large penal, or small piece.
·Powerful and flexible. |
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| 椭偏仪
Ellipsometer |
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应用领域:
IC fab,
wafer manufacturing, MEMS, LED, solar cell, photonics,
nano tech.
设备特性:
Gaertner 精密光学仪器具有一百多年的历史, 它的 ellipsometers 享誉全球.
有激光椭偏仪和光谱椭偏仪.
·用于精密检测各种薄膜的厚度, 包括oxide, nitride, metal oxide, ITO.
·采用四极偏振器, 无转动器件, 稳定性强, 准确率高.
·膜厚范围可自0nm 到6000nm. 可具有达12”直径自动 mapping 功能. |
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| 晶圆几何特性检测
Wafer
Measurement Systems |
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应用领域:
Wafer manufacturing
(Si, GaAs等), IC fab, solar cell, MEMS, photonics.
设备特性:
晶圆几何特性检测设备包括从手动到全自动的系列产品.
·检测几何参数包括：Thickness, TTV, Bow, Warp, and Flatness.
·采用独特的Push/Pull电容传感测试技术,可测试GaAs、SiC、Si等半导材料.
·对普通电容传感式设备无法监测的高阻率材料,该设备都能监测.
·产品以 ASTM Specifications 为标准. |
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| 晶片微缺陷检测
Wafer
Defects Metrology |
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应用领域:
Wafer
manufacturing (Si, GaAs等), IC fab, solar cell, MEMS.
设备特性:
Automatic defects detection system with on high
resolution microscopy.
·Automatic defect detection and classification.
·Blank wafers, device patterned wafers, SOI wafers.
·CD measurement.
·In-line or off-line for FPD and think film solar
panels. |
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| 晶片缺陷快测魔镜
Magic
Mirror |
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应用领域:
Wafer
manufacturing (Si, GaAs等), IC fab, MEMS.
设备特性:
Magic Mirror, 测晶片缺陷的经典手段.
·Detect dimple and depressed areas.
·Detect mounds and raised areas.
·Detect slip lines.
·Manual models or high throughput automatic models.
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| 晶格位挫检测
Wafer
Slip Finder |
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应用领域:
Wafer
manufacturing (Si, GaAs等), IC fab, MEMS.
设备特性:
Automated submicron slip detection systems.
·Epi, RTP, Diffusion, Annealing, SOI.
·Blank wafers, device patterned wafers, SOI wafers.
·Up to 300 mm wafer sizes.
·Manual models or high throughput automatic models.
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微光斑薄膜测试仪
Micro-Spectrophotometer
for Thin Film Measurement |
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应用领域:
IC fab,
MEMS, photonics, nano technologies.
设备特性:
Angstrom Sun 微斑光谱薄膜测试仪广泛用于微小区域薄膜测试.
·可测多达5层的膜厚，可测反射、透射及吸收光谱. 检测光斑可小达5 μm.
·光谱范围广, 检测膜厚达10 nm to 25 ?m.
·可具有高达12”直径自动 mapping 功能，软件功能强大.
·可具有高灵敏度数吗摄像功能. |
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光谱薄膜测试仪
Spectro-Refelctometer
for Thin Film Measurement |
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应用领域:
IC fab, MEMS, LED, solar cell, photonics, nano technologies.
设备特性:
光谱反射仪广泛用于各种透明、半透明薄膜测试.
·用于检测各种薄膜的厚度, 包括oxide, nitride, photo resist, metal
oxide, ITO.
·膜厚范围可自10 nm to 50 ?m. 可选各种光谱范围, 自UV 200nm到IR 1700nm,
以满足各类材料检测的需要.
·可具有高达12”直径自动 mapping 功能. 可检测多达5层薄膜. |
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| 非接触式电阻率测试仪
Contactless Resistivity Systems |
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应用领域:
IC fab, wafer
manufacturing, solar cell, LED, MEMS, FPD, photonics.
广泛用于 GaAs, Si, and Metal characterizations.
设备特性:
Lehighton serves IC and electronics industry for
over 40 years.
·LEI contactless resistivity measurement systems
以非接触方式检测 sheet resistance
and bulk resistivity. LEI 提供从R&D 简易型到自动生产型等一系列型号.
·对样品表面无接触损害. |
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非接触式迁移率测试仪
Non-Contact Mobility Systems |
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应用领域:
IC fab,
wafer manufacturing, LED, MEMS, FPD, photonics..
设备特性:
Lehighton serves IC and electronics industry for
over 40 years.
·LEI 提供一系列非接触式迁移率测试仪, non-contact Mobility Measurement
Systems.
·Measures various semiconductor transport properties,
including mobility, carrier density (sheet or bulk),
via a non-contact measurement method.
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| 电镜
离子束分析
SEM CD/SEM FIB |
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赛伦科技提供翻新SEM,
CD/SEM, FIB.
·Hitachi, Micrion, FEI JOEL, and more.
·所有机台全都经过全面翻新, 符合OEM指标.
·提供保修, 优质服务
·On-site installation, customer service.
·Best quality, Excellent value. |
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