Product Detail
Brand: AST
Model: SE200BA-MSP

Ellipsometry is a technique utilizing polarization state changes  after light beam reacts with probing samples. Not like reflectometer, spectroscopic ellipsometer parameters (Psi and Del) are always obtained at non normal incident angles. By varying incident angle. many more data sets can be obtained which wiil be helpful in refining model, reducing uncertainty and improving user's confidence on model's output. Therefore, variable angle ellipsometer is far more powerful  than fixed angle ellipsometer systems. There are two ways to change incident angles, manually or automatically. Ansgtrom Sun technologies Inc designed both angle adjustment models, manually adjusting agnle by moving arms at 5 degree interval following precisely preset slots(manual goniometer, SExxxBM, low cost version), and motorized precision goniometer with 0.01 degree resolution(SExxxBA). In addition, goniometers are engineeringed at vertical layout so samples could be placed horizontally, which is safer when handling samples. With reliable and enough raw data sets, many film properties, like film thickness, its optical constants, interface, porosity and even composition can be obtained through modeling. In this sense, advanced software is a must for high performance spectroscopic ellipsometer (SE) tools. We developed TFProbe 3.X version software for system setup. simulation, measurement, analysis, data management and 2D/3D graphics presentation. It is all-in-one.

When a very small probing spot is desired for some applications, like features on MEMS or semiconductor product wafers, microspectrophotometer is prefered to use. It can be integrated with spectroscopic ellipsometer to provide the needs for small measurement area capability. Model SExxxBA-MSP or Model SExxxBM-MSP is designed for such purpose. MSP works under reflectometry mode and run measuremment at normal incident angle which is complimentary to non-normal incident angle SE setup


● Easy to operate with Window based software

Advanced optics design for best system performance

Automatically change incident angles at 0.01 degree resolution

High Power DUV-VIS light source for broad band applications

Array based detector system to ensure fast measurement

Measure film thickness and Refractive Index up to 12 layers

Capable to be used for real time or in-line thickness, refractive index monitoring

System comes with comprehensive optical constants database and library

Advanced TFProbe 3.3.X Software allows user to use either NK table, dispersion or effective media   approximation (EMA) for each individual film.

Three different user level control: Engineer mode, system service mode and easy user mode

Flexible engineer mode for various recipe setup and optical model testing

Robust one click button (Turn-key) solution for quick and routine measurement

Configurable measurement parameters, user preference and easiness of operation

Fully automatic calibration and initialization for system

Precise sample alignment interface from sample signal directly, no external optics needed

Precise height and tilting adjustment

Apply to many different type of substrates with different thickness

Various options, accessories available for special configurations such as mapping stage, wavelength        extension, focus spot etc.

2D and 3D output graphics and user friendly data management interface

Digital Imaging Tool for Micron region selection

Integrated Reflectometer for Reflection measurement over small region


Model: SE200BA-MSP300

Detector: Detector Array

Light Source: High Power DUV-Vis-NIR Combined Light Source for SE and High Power Visible Light Source for MSP

Incident Angle Change: Automatic with Program setting

Stage: Automatic Mapping with Rho-Theta configuration

Software: TFProbe 3.3.X

Combined SE and MSP

Computer: Intel Duo Core Processor

Monitor 19" Wide Screen LCD

Power: 110– 240 VAC /50-60Hz, 6 A

Warranty: One year labor and parts


Wavelength range: 250 to 1000 nm  for SE and 400 to 850nm for MSP

Wavelength resolution: ~1 nm

Spot Size: 1 to 5 mm variable for SE

Incident Angle Range: 10 to 90 degree

Incident Angle Change Resolution: 0.01 degree

Digital Imaging: 1.3 MegPixels

Effective Magnification: 1200x

Long Work distance objective (12mm)

MSP Beam Size: adjustable 10 - 500 um

Sample Size: up to 300 mm in diameter

Substrate Size: up to 20mm thick

Measurable thickness range*: 0 nm to 10 µm

Measurement Time: ~ 1s/Site

Accuracy*: better than 0.25%

Repeatability*: < 1 Å (1 sigma from 50 thickness readings for 1500 Å Thermal SiO2 on Si Wafer)


Photometry measurement for Reflection at Non normal incident angle

Transmission Measurement Module

High resolution digital camera

Ultra Long work distance objective for MSP

Mapping X-Y Stage (X-Y mode, instead of Rho-Theta mode)

Heating /Cooling Stage

Vertical Sample Mounting Goniometer

Wavelength extension to further DUV or IR range

Scanning Monochromator Setup


Semiconductor fabrication (PR, Oxide, Nitride..)

Liquid crystal display (ITO, PR, Cell gap…..)

Forensics, Biological films and materials

Inks, Mineralogy, Pigments, Toners

Pharmaceuticals, Medial Devices

Optical coatings, TiO2, SiO2, Ta2O5…..

Semiconductor compounds

Functional films in MEMS/MOEMS

Amorphous, nano and crystalline Si


System configuration and Specifications subject to change without notice

* Film property, surface quality and layer stack dependent

Customized system available for special applications

TFProbe is registered trademark of Angstrom Sun Technologies Inc.

美国:+1 (408) 420-3561    |   北京:+86 (010) 62561331    |   上海:+86 (021) 61363596

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